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Pattern card for direct-mounted ceramic components

Assignee: Ericsson Telefon Ab L M
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Filing: 1982-04-30
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Granted: —
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Expires: 2002-04-30
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Abstract

Abstract The invention concerns a pattern card for direct-mounted ceramic components. Such cards contain a base sheet with low coefficient of thermal expansion and a pattern carrier with a conductor pattern on which the ceramic components are to be directly mounted. According to the invention, the base sheet consists of electrically insulating material and the pattern carrier is fastened to one side of the base sheet by an elastic bonding agent.

Inventors

  • 👤 A Bareksten
  • 👤 R Bergman

Bibliographic Details

Application Number —
Jurisdiction SE
Data Source google_patents
Last Synchronized 2026-11-04 19:49
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/03; H05K1/0306; H05K3/00; H05K3/10; H05K3/20; H05K3/38; H05K3/386

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