Manufacture of tape carrier

Abstract

Abstract PURPOSE:To allow an inexpensive, easy, and reliable formation of a bump consisting of a conductive paste on the back side of an inner lead by boring a hole in a substrate film, and injecting an inexpensive conductive paste into the hole capped with a copper film, and hardening such paste. CONSTITUTION:An etching mask 13 is formed on the film face of a flexible film 11, one face of which is coated with copper. By etching the flexible film 11 by chemical etching, a hole 14 which is capped with the copper film is formed. Then a conductive paste is filled in the hole 14 and hardened by a screen printing method. Then a circuit is formed on a copper film 12 by a subtractive method. By forming a device hole 19 of the flexible film by etching, a bump 16 which has been formed on the tip of a lead 17 appears. After this, the bump 16 is roughened, if necessary, and the surface of the conductive paste 16 or the lead 17 is Sn plated, or Au plated over the Ni plating.

Inventors

• 👤 Yoshihiro Namikawa
• 👤 Kazuhiro Furukawa
• 👤 Katsuo Kawaguchi

Bibliographic Details