Patent JPS6489356A successfully refreshed from Google Patents.
JPS6489356A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Hybrid integrated circuit
Assignee: NEC Corp
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Filing: 1987-09-29
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Granted: —
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Expires: 2007-09-29
Abstract
Abstract PURPOSE:To reduce in size and to enhance in mounting density a hybrid integrated circuit by placing an IC chip also on a ceramic cap for sealing the chip. CONSTITUTION:An IC chip 4 is placed on a substrate 1, and sealed with a ceramic cap 2 by employing a resin or solder sealer 5. The chip 4 is mounted on the cap 2, bonded, and coated with a coating resin 3 thereon.
Inventors
- 👤 Yasuhisa Koike
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 14:17
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0284; H05K1/14; H05K1/144; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 0
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