Package for containing semiconductor element

Abstract

Abstract PURPOSE:To mount an insulating layer on a metal body rigidly with large electric insulation by employing a sintered porous material made of one or more types of W and Mo impregnated in its gaps with copper as the body for placing a semiconductor element. CONSTITUTION:A placing unit 1a for placing a semiconductor element 3 is provided at the center on the upper face of a metal body 1, and the element 3 is mounted on the unit 1a. The lower surface of the body 1 is covered with an insulating layer 1b. The body having the layer 1b on its lower surface is formed of a sintered porous material made of at least one type of W and Mo impregnated in its gaps with Cu. Thus, the layer 1b can be mounted on the body 1 rigidly with large electric insulation. As a result, when it is mounted on a circuit substrate, other electronic component and wiring lead are not brought into direct contact with the body 1, thereby operating the element 3 normally and stably for a long time.

Inventors

• 👤 Hiroshi Toki

Bibliographic Details