Semiconductor device

Abstract

Abstract PURPOSE:To reduce wiring resistance by thickly forming a bridge pile of an air bridge as compared with a first layer wiring to increase the contact of the pile with the bridge plate of air bridge wirings. CONSTITUTION:A bridge pile 20 formed thickly as compared with a first layer wiring 1, and a bridge plate 30 formed widely in its line width are formed, and the contact area with the plate 30 wired on the pile 20 is designated by 40. Thus, since the pile 20 is thickly formed to increase its mechanical strength and the contact area 40 with the plate 20 of upper layer wiring is increased, the wiring resistance of an air bridge wiring can be reduced.

Inventors

• 👤 Takashi Matsuoka

Bibliographic Details