Semiconductor chip

Abstract

Abstract PURPOSE:To shorten a time required for a sorting system, to improve yield and reliability of a semiconductor element and to improve the sorting accuracy in assembling steps by providing a line having a pair of electrodes at both ends at an arbitrary position on a semiconductor substrate, and fusion- disconnecting or nonfusion-disconnecting it in response to the inspection result of the element. CONSTITUTION:Electrodes 1d are connected by a probing unit to an inspecting device, a current does not flow on the basis of an inspection result in case of good one by a probe 2b of the unit, and an overcurrent flows in case of an improper one. When the current flows, a pattern 2a formed locally finely at a line 1e between the electrodes 1d is heated due to its resistance component, and the line 1e is momentarily fusion-disconnected. When the short-circuit and opening of the line 1e is confirmed in assembling steps, a semiconductor chip is effectively sorted. The electrodes 1d, the line 1e are positioned with respect to a reference plane to be mounted to easily automate the sorting in the assembling step, thereby improving sorting accuracy.

Inventors

• 👤 Chikahiro Toukawa

Bibliographic Details