Semiconductor device

Abstract

Abstract PURPOSE:To shorten the wiring between an IC chip and a capacitor as well as to remove the unnecessary alternating-circuit component of a power source system or a signal by a method wherein the title semiconductor device is constructed in such a manner that a capacitor is incorporated into the cap part of the package to be used for the semiconductor device. CONSTITUTION:Electrodes 1 and 2 are buried in a cap 5, and a capacitor 3 is formed with the electrodes 1 and 2 and the ceramic located between them. A seam-sealing metallized layer 4 is formed on the insulating part 14 located on the circumference of the capacitor 3. The cap 5 is placed on the upper part of a ceramic case 13, and it is seam-weld sealed with the metallized layer 4 and a seam-ring 8. An edge of the wiring 7 in the case is connected to a switch 10, another edge of the wiring 7 is connected to an IC chip 9 through a bonding wire 12, and other edge is connected to the external terminal. As a result, the wiring from the chip 9 to the capacitor 3 is made short, and the unnecessary alternating component of a power source system and a signal can be removed.

Inventors

• 👤 Takafumi Tamura

Bibliographic Details