Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To allow a large-sized chip to be equipped so that it does not draw inner leads round at end parts of longer sides of a tab, by arranging a plurality of inner and outer leads along the longer sides of its rectangular tab part. CONSTITUTION:A 4M bit DRAM semiconductor chip 20 is equipped on the surface of a tab part 11 through adhesives. A plurality of inner and outer leads 12 and 13 are arranged along longer sides of the tab part 11. Then, unlike conventional manners, it is unnecessary for this chip to draw a plurality of inner leads round from each longer side to shorter side at end parts of the longer sides. As this approach may leave some surplus of the size in the longer side direction, even the large-sized semiconductor chip 20 can be formed at the resin sealed type semiconductor device having a prescribed size.

Inventors

• 👤 Toshihiro Yasuhara
• 👤 Masachika Masuda
• 👤 Hajime Murakami
• 👤 Kunihiko Nishi
• 👤 Masakazu Sakimoto

Bibliographic Details