Tape carrier for semiconductor device

Abstract

Abstract PURPOSE:To obtain a carrier tape for a semiconductor device and capable of mounting in a high integration degree using the same tape carrier by a method wherein memory ICs are bonded to the same tape carrier and each IC is provided with a plurality of outer lead terminals for chip select terminals. CONSTITUTION:A Cu foil is laminated on a tape carrier 1 consisting of a polyimide and so on and thereafter, after lead terminal patterns are formed, an Sn plating is applied to these patterns. Outer lead terminals 10 only for chip select terminals are formed two in number adjoining outer lead terminals 6. Inner lead terminals 7 of this tape carrier and Au bumps of an IC 8 are thermally fixed by pressure to each other. When the ICs 8 are mounted on a printed substrate in a two-stage superposition and are superposed on the upper and lower surfaces of the substrate, the terminals 10 only are cut off arbitrarily in such a way that these are not superposed on each other and are mounted on the upper and lower surfaces of the substrate. Thereby, a highly integrated mounting of two times of the conventional mounting becomes possible.

Inventors

• 👤 Ryutaro Arakawa
• 👤 Kimitaka Koseki

Bibliographic Details