Semiconductor device

Abstract

Abstract PURPOSE:To prevent the generation of crack in resin sealing member, by providing a stress dispersing means to disperse stress in an insulating film for mounting semiconductor chip, in a semiconductor device sealed with resin sealing material. CONSTITUTION:An insulating film 2 is composed of divided insulating films 2a, 2b, 2c, 2d, which are made up, e.g., of polyimide resin material of 125mum thick. On the divided insulating films 2a, 2b, 2c, 2d, semiconductor chip 4 is bonded as a pellet with pellet bonding adhesive agent 5. By dividing, in this manner, the insulating film for mounting the semiconductor chip 4 into the divided insulating films 2a, 2b, 2c, 2d, the stress generating in the divided insulating films 2a, 2b, 2c, 2d is dispersed into four divisions, so that the generation of crack in resin sealing member 7 such as resin can be prevented.

Inventors

• 👤 Hajime Sato
• 👤 Hiromichi Suzuki

Bibliographic Details