Probing device

Abstract

Abstract PURPOSE: To enable accurate probing measurement, and to improve the operating efficiency of a probing device by also spraying air against a probing needle when air is sprayed onto a semiconductor wafer, dust is removed and the wafer is tested. CONSTITUTION: Nozzles 10 are set up around a polishing base 11 polishing a probing needle 8 abutted to a measuring stage 6 in numbers such as two. The nozzles 10 are connected to an air intake section 13 through a tube 12, and control the outflow of air. The measuring stage 6 is moved, and the nozzles 10 are mounted just under the probing needle 8. The polishing base 11 is moved up, air is flowed into the nozzles 10 through the tube 12 from the air intake section 13, and air is ejected toward the probing needle 8. Accordingly, when the probing needle is brought into contact with an electrode pad and a wafer is tested, air is also sprayed against the probing needle, thus allowing accurate probing measurement, then improving the operating efficiency of a probing device. COPYRIGHT: (C)1989,JPO&Japio

Inventors

• 👤 Wataru Karasawa

Bibliographic Details