Probe device

Abstract

Abstract PURPOSE:To polish a probe stylus effectively by allowing the probe stylus to abut on an abrasive part at different positions and thus preventing dust such as scraps of aluminum produced from the probe stylus from sticking on the probe stylus again. CONSTITUTION:A wafer stage 9 is moved in the X and Y directions during a test of a wafer 6 to position an IC chip mounted on the wafer 6 under the probe stylus 2 successively, and then a Z stage 8 is moved up and down to bring the probe stylus 2 into electric contact with the bonding pad of the IC chip. If the probe stylus needs to be polished during the test of the wafer, the wafer stage 9 is moved in the X and Y directions to position the abrasive plate 3 under the probe stylus 2, and the Z stage 8 is moved up and down at this position to allow the abrasive plate 3 to abut on the probe stylus 2 several times. In this case, the wafer stage 9 is moved finely in the X and Y directions every time the abrasive plate 3 to make a shift of the abutting position of the probe stylus 2 to the abrasive plate 3.

Inventors

• 👤 Teruya Sato
• 👤 光弥 佐藤

Bibliographic Details