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JPS6473902A Expired / Lapsed JP ⏱️ 0.0 years remaining

Interconnection line for microwave integrated circuit substrate

Assignee: NEC Corp
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Filing: 1987-09-16
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Granted: —
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Expires: 2007-09-16
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Abstract

Abstract PURPOSE:To obtain an MIC substrate interconnection line stable against temperature change without being affected by a ground conductor by connecting a three-wire coplanar balun between both ends of a balanced line. CONSTITUTION:A 1st three-wire coplanar balun 7 whose high frequency characteristic is excellent converts the unbalanced mode of an input strip line into the balanced mode. A 2nd three-wire coplaner balun 8 converts the mode from the balanced mode into the unbalanced mode again. The length of the 1st and 2nd three-wire coplanar lines 7, 8 is lambda0/4. Moreover, the balanced line section of the balanced line 9 is formed by a suspended line. Thus, the current of the equal width and opposite phase flows respectively from the center conductor to the ground line in the unbalanced mode part at both ends, but a current flows between a couple of lines in the balanced line part 9 and no ground current flows, then the effect of the ground conductor is eliminated.

Inventors

  • 👤 Isao Izumi

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-07 12:21
CPC Classifications
—

Claims Analysis

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References Cited (Backward Citations)

JPS4989185A Cited

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