Plane mounting type semiconductor device

Abstract

Abstract PURPOSE:To improve the accuracy of alignment by forming an alignment lead terminal being projected from the outer circumferential section of a semiconductor device, being bent in the downward vertical direction and capable of being implanted to a printed board. CONSTITUTION:Alignment lead terminals 7 projected from the side faces of, corner sections 6 and bent in the downward vertical direction are shaped to a package besides lead terminals 2. The alignment lead terminals 7 at two positions in total including the alignment lead terminals 7 at corner sections on the diagonal sides of the package are inserted and implanted to two recessed sections 8 formed onto a printed board 3, said package body is aligned, and a soldering process is executed. Accordingly, the accuracy of mounting of the printed board in the package is improved, thus preventing the positional displacement of the lead terminals.

Inventors

• 👤 Yuki Maeda

Bibliographic Details