Manufacture of wiring board

Abstract

Abstract PURPOSE:To obtain a wiring board, having excellent flexibility and rigidity, on which a bending work for formation of an arbitrary shape can be conducted by a method wherein a metal foil is provided through the intermediary of a plastic film on the upper surface and/or the lower surface of the hard substrate on which required number of slits are provided on the expected part of bending, and after a circuit has been formed by wiring substrate formed by lamination, the hard substrate located between slits is removed. CONSTITUTION:A sheet of metal foil is arranged on the upper surface and/or the lower surface of the hard substrate on which required number of slits are provided at the expected part for bending through the intermediary of a plastic film, and after a circuit has been formed on the circuit substrate obtained by lamination, the hard substrate between slits is removed. A resin-laminated plate, and an independent metal, an alloy, a combination of metals and the like of aluminum, iron, copper, nickel, zinc, chromium and the like is used for the hard substrate, the thickness of 0.1-3.0mm is desirable from the viewpoint of handling. Pertaining to the removal of the hard substrate located between slits, the chemical treatment such as an etching treatment and the like, and the physical treatment such as grinding and the like can be optionally used.

Inventors

• 👤 Munehiko Fukushima
• 👤 Daizo Baba
• 👤 Taizo Kitamura
• 👤 Hajime Kawakami

Bibliographic Details