Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To reduce the total cost of an electronic equipment by annexing a means lowering high-frequency noises generated from a digital signal to integrated circuit itself in a semiconductor integrated circuit using the digital signal. CONSTITUTION:The whole integrated circuit is coated with an aluminum film 30 with the exception of Pads 31 for bonding for connecting signals input to an integrated circuit and signals output from the integrated circuit, and a shielding film is connected to a GND terminal 32 fed to the integrated circuit. Electromagnetic wave noises generated from the integrated circuit are captured by the aluminum shielding film, and passed out to a GND electrode instantaneously and noises can be removed.

Inventors

• 👤 Sumio Mizobe

Bibliographic Details