Low temperature wiring board for mounting electronic circuit device chip

Abstract

Abstract PURPOSE:To prevent the connecting part of a wiring layer from breaking even if the connecting part is subjected to a heat cycle between a room temperature and a low temperature by a method wherein an insulating layer is formed on the surface of a board main body comprising Fe-Ni base alloy containing a specific amount of Ni through the intermediary of a superconductor layer and then a superconductor wiring layer is formed on the insulating layer. CONSTITUTION:An insulating layer 3 is formed on the surface of a board main body 1 comprising Fe-Ni base alloy containing Ni in 30-44weight% through the intermediary of a superconductor layer 2 and then a superconductor wiring layer 4 is formed on the insulating layer 3. For example, the insulating layer 3 comprising SiO2 etc., is formed on the surface of the board main body 1 comprising Fe-Ni base alloy containing Ni in 30-44weight% through the intermediary of the superconductor layer 2 comprising Nb, 50% Pb-50% Sn alloy etc. and then the superconductor wiring layer 4 comprising 84% Pb-12% In-4% Au alloy, Ta, etc., is formed on the insulating layer 3 in the mode wherein the superconductor wiring layer 4 is connected to the superconductor layer 2 through an opening 7 perforated into the specified part of the insulating layer 3. Finally, an electronic circuit device chip 5 comprising silicon, sapphire. ceramic, etc., is enabled to be mounted.

Inventors

• 👤 Koichi Fujiwara

Bibliographic Details