Mounting structure of hybrid integrated circuit component

Abstract

Abstract PURPOSE:To make the length of wiring to a minimum, and enable high density integration, by arranging circuit components in recessed parts with depth corresponding with heights of circuit components, making the electrode surface of the circuit components and the conductor pattern surface formed on the substrate surface to be connected identical, and connecting them with wiring materials. CONSTITUTION:On a hybrid integrated circuit substrate 6, recessed parts 81, 81' with depth corresponding with the heights of circuit components 2, 3 are formed, by making holes in the highest layer of laminated green sheets 8 or a plurality of the layers containing the highest layer. In the recessed parts 81, 81', the circuit components 2 and 3 are arranged, and the electrode surfaces of the circuit components 2, 3 and the conductor pattern surface formed on the substrate surface to be connected is made identical, which connected by wiring material 7, 4. For example, in the respective recessed parts 81, 81' on the hybrid integrated circuit substrate 6 formed in the above-mentioned manner, the chip component 2 and a bare chip 3 are inserted and arranged. The electrode of the chip component 2 and a conductor pattern 61 are connected with a connecting thin plate 7. The electrode of the bare chip 3 and the conductor pattern 61 are connected with the wire 4. Wire bonding is applied in these cases.

Inventors

• 👤 Kenichiro Tsubone
• 👤 Hidenori Tanizawa
• 👤 Yuko Suzuki

Bibliographic Details