Transparent plastic mold image sensor

Abstract

Abstract PURPOSE:To reduce cost by assembling a solid-state image sensor on a printed circuit board and molding the surface by a transparent plastic so as to eliminate the need for a ceramic package adhered with a glass window thereby attaining light weight and compact size. CONSTITUTION:A printed wire 2 made of a tungsten with/without metal plating is applied to a printed circuit board made of a plastic or ceramic, a solid-state image sensor 3 is adhered to the wire 2 by a conductive epoxy adhesives, a lead wire 4 made of gold, aluminum or copper is used to connect the sensor 3 and the wire 2. The sensor 3 together with its terminal is covered by a transparent plastic 5, or a recessed part is provided to the surface of the board 1 and the sensor is provided therein.

Inventors

• 👤 Seiichi Iwamatsu

Bibliographic Details