Three-dimensional semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To reduce time for inserting and pulling-out a chip at the time of maintenance and exchange accompanying an increase in the number of sheets of longitudinally stacked chips by a method wherein connection chips provided with a connector, which is easily detachable and is electrically connected, are provided. CONSTITUTION:A plurality of sheets of chips or wafers 1 are stacked longitudinally to each other, are connected electrically to each other at surfaces A and moreover, are fixed mechanically to each other. Chip groups 3, each consisting of a plurality of sheets of the chips, are connected to each other at surfaces B through con nection chips 2 having a connector, which is an easily detachable electrical connecting means. For example, in the case where 100 sheets of the chips 1 are stacked longitudinally, if 20 sheets of the chips 1 are collected into one chip group 3, the total is constituted of 5 maintenance and exchange units and the time needed for maintenance and exchange can be reduced. The connector structures appear only at 4 places among 100 sheets if the chips 1 and the effect to inflict on the high-speed operating efficiency of a whole device is little.

Inventors

• 👤 Moritoshi Yasunaga
• 👤 Minoru Yamada
• 👤 Kenichi Mizuishi

Bibliographic Details