Manufacture of resin mold having electronic parts

Abstract

Abstract PURPOSE:To avoid position deviation of electronic parts, and obtain resin moldings excellent in airtight property, by fixing a base film having exfoliating property on which electronic parts are fixed with adhesive agent, at a specified position in a metal mold, and unifying the electronic parts in a body. CONSTITUTION:A base film 1 on which electronic parts are fixed is arranged at a specified position in a metal mold 4. If necessary, the film 1 is fixed outside the cavity of the metal mold 4. After the metal mold 4 is closed, thermoplastic or the like is injection-molded to form resin moldings. From the metal mold 4, the resin moldings are taken out, and the film is exfoliated from the resin moldings. Thereby, position deviation of parts 3 is avoided, and resin moldings excellent in airtight property can be obtained.

Inventors

• 👤 Tokumasa Higuchi
• 👤 Yuzo Nakamura
• 👤 Toshiyuki Ito

Bibliographic Details