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JPS644499A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method and device for rotary plating

Assignee: HIKIFUNE KK
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Filing: 1987-06-25
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Granted: —
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Expires: 2007-06-25
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Abstract

Abstract PURPOSE:To easily, efficiently, and uniformly electroplating each material to be plated separately or altogether by connecting plural materials to be plated in the axial direction of rotation, holding the materials in a plating soln., and revolving and rotating the materials with respect to an anode. CONSTITUTION:An anode plate 21 is arranged along the inner periphery of a plating bath 2 set on a rack 1 and contg. a plating soln., and connected to the positive pole of a DC power source. The upper and lower supporting plates 8 and 13 of the rotating shaft 4 provided along the center axis of the plating bath 2 are set, and a rotatable rod-shaped jig 16 connecting and holding plural materials 22 to be plated is set between the plates 8 and 13 around and in parallel with the center axis. The shaft 4 is rotated by a motor 7 through a bevel gear mechanism 5, and the jig 16 is revolved and rotated through a gear 9 and a pinion 19. The material 22 is simultaneously connected to the negative pole of the DC power source through the jig 16, a rotary connector 20, the upper rotary supporting plate 8, the rotating shaft 4, and a rotary conductive box 6. As a result, the material 22 is rotated and electroplated.

Inventors

  • 👤 Michio Kobayashi

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 19:19
CPC Classifications
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