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JPS644023A Expired / Lapsed JP ⏱️ 0.0 years remaining

Dry etching device

Assignee: Toppan Inc
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Filing: 1987-06-26
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Granted: —
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Expires: 2007-06-26
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Abstract

Abstract PURPOSE:To improve an etching shape and the etching uniformity and to enhance the universality of an ECR dry etching device by a method wherein a magnetic coil surrounding a plasma generation chamber is divided and excitation currents which are mutually independent are made to flow. CONSTITUTION:Excitation currents are designated as i8-i10 in divided magnetic coils 8-10; if the electric currents specified as i8<i9<i10 flow, a strength distribution 11 of a magnetic field approaches a line parallel to an axis; a region 12 which satisfied a condition for electron cyclotron resonance (ECR) by microwaves is extended to a wider range of a plasma generation chamber; an electric discharge at a low gas pressure becomes possible. If the excitation currents i8-i10 are controlled at appropriate values, it is possible to form a ring-shaped high ion density region of an optimum size corresponding to a change in a size of a wafer and a change in an etching condition. By this setup, an ECR dry etching device can be applied to an etching operation requiring the low shock energy in order to suppress the damage on the surface.

Inventors

  • 👤 Tadashi Matsuo
  • 👤 Osamu Masutomi
  • 👤 Masao Otaki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 08:04
CPC Classifications
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References Cited (Backward Citations)

JPS61177728A Cited

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