Detection of defective mounting of chip component

Abstract

Abstract PURPOSE:To easily and surely detect defective mounting of a chip component such as omission, displacement, detachment or the like by a method wherein an adhesive mixed with a fluorescent agant is coated on a part to mount the chip component and the existence of fluorescence is observed in a darkroom. CONSTITUTION:A recessed part 5 to house a substrate 1 is made on an upper face of a darkroom 4. An adhesive 2 is coated on a part to mount a chip component 3 on the substrate 1. The chip component 3 is pressed onto the part to mount the component and coated with the adhesive 2. The substrate 1 where the chip component 3 is mounted is housed in the recessed part 5 of the darkroom 4 and is observed visually from an upper part of the recessed part 5. During this process, if the chip component 3 is mounted on the prescribed part, the chip component 3 covers the adhesive 2 and the fluorescence of the adhesive 2 is shut off and cannot be confirmed visually; it is detected that no defective mounting exists. To the contrary, if the chip component 3 is detached as indicated by B, the adhesive 2 is exposed on the surface of the substrate 1, its fluorescence can be confirmed visually, and the defective mounting can be detected.

Inventors

• 👤 Takayuki Yasui

Bibliographic Details