Manufacture of integrated circuit package

Abstract

Abstract PURPOSE:To make it possible to obtain easily the flatness of the bottom surface of a recessed part and the flatness of a peripheral surface part for mounting a lead frame by a method wherein a penetrated hole of a planar dimension equal to that of the recessed part for mounting a semiconductor chip is provided in an upper plate. CONSTITUTION:An upper plate has the same planar dimension as that of a container 16 and has a penetrated hole 18 of the same planar dimension as that of a recessed part 7 at its central part. The upper plate 16a consisting of a tabular metal core material 17a covered with a metal oxide is manufactured and a lower plate 16b, which has the same external dimensions as those of the plate 16a and consists of a tabular metal core material 21a covered with a metal oxide, is manufactured. Moreover, the plates 16a and 16b are laminated to form integrally. Thereby, there exists no protruding part, which is an obstacle to conveyance, and moreover, the peripheral surface part, on which a lead frame is mounted, of the integrally formed plate can be flattened regardless of the depth of the recessed part and the thickness of the metal plate materials to be used.

Inventors

• 👤 Masayasu Kojima
• 👤 Heihachi Fujii

Bibliographic Details