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JPS6432631A Expired / Lapsed JP ⏱️ 0.0 years remaining

Etching device

Assignee: Toshiba Corp
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Filing: 1987-07-29
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Granted: —
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Expires: 2007-07-29
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Abstract

Abstract PURPOSE:To conduct etching having high anisotropy at high speed by forming a high-frequency electric field between a wafer and an upper plate by a high-frequency power and shaping a microwave electromagnetic field in the upper space of the wafer. CONSTITUTION:A magnetic field coil 14 is conducted for generating electrocyclotron discharge, and a magnetic field having 875 Gauss is generated at a certain position in the upper section of a sample base 6. When the sample base 6 is supplied with power through a high-frequency power 9 and a capacitor 10, discharge is generated between the sample base 6 and an upper plate 16, and an ion sheath having a certain potential is generated on the sample base 6. Ions are accelerated by the potential, but ion energy at that time is approximately proportional to high-frequency power. Consequently, a large number of ions are acquired by small power. Accordingly, etching having high anisotropy is performed at high speed.

Inventors

  • 👤 Naoyoshi Fujiwara
  • 👤 Kotaro Hamashima
  • 👤 Masanobu Nakano

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 03:01
CPC Classifications
—

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