Method and device for polishing wafer

Abstract

Abstract PURPOSE:To enable a wafer to be high accurately polished by gluing the wafer to the bottom surface of a rotatable plate and applying the predetermined pressure of fluid uniformly acting on the upper surface of the plate so that the plate substantially eliminates its flexing deformation holding flatness to a high degree. CONSTITUTION:A polishing device, gluing a wafer W to the bottom surface of a plate 1, placing it on a turn table 3 with this wafer glued surface in the bottom and pressing the plate 1 by a top ring 8 forming its bottom part into a reversed dish shape, performs mirror polishing of the wafer W by relatively slipping the wafer W with the turn table 3. The device, which provides a flexible thin film (pressing plate) 11 extending in the bottom surface or the top ring 8 to form enclosed space 12, presses the plate 1 by supplying pressure fluid to the enclosed space 12 from a fluid supply source. The pressure of this pressure fluid is adjusted by a pressure adjusting mechanism 13, and the device, applying a uniform pressure acting on the upper surface of the plate 1 and placing it in a condition generating no flexing deformation, polishes the wafer with high accuracy.

Inventors

• 👤 Satoru Kitsuta

Bibliographic Details