Semiconductor device

Abstract

Abstract PURPOSE: To obtain a positive magnetic shielding effect by previously bringing lead pins set up around a semiconductor element into contact with a metallic layer formed onto the surface of a substrate made of plastics and a cap made of a metal when the element is mounted onto the rear of the substrate and the rear of the substrate including the element is covered with the cap through a sealing resin frame. CONSTITUTION: A recessed section is shaped to the rear of a substrate 1 made of plastics, a semiconductor element 8 is buried into the recessed section, and terminals fitted to the semiconductor element 8 are connected to a metallic layer surrounding the element 8 by using bonding wires 9. The whole rear including the element 8 is hermetically sealed with a cap 5 made of a metal through a resin sealing frame 6, through-holes 11 are bored penetrated through the metallic layer 2 applied onto the surface of the substrate 1 and the cap 5, lead pins 3 are inserted into the through-holes 11 while being protruded from the rear of the substrate 1, and fixed to a metallic layer 12 on the rear of the cap 5 by employing solder 4, and the pins 3 are connected to a power supply. Accordingly, the metallic layers are shaped onto the surface and rear of the substrate 1 and connected by the lead pins 3 through the through-holes 11, thus completing electromagnetic shielding to the element 8. COPYRIGHT: (C)1989,JPO&Japio

Inventors

• 👤 Yoshinori Takasaki
• 👤 Hajime Yatsu

Bibliographic Details