Manufacture of semiconductor device

Abstract

Abstract PURPOSE: To make the external force to be applied to a bump uniform and to prevent the bump from peeling at the time of bonding by a method wherein an organic insulating film having an aperture is provided on an electrode pad and a metal-plated layer is provided in the aperture of the organic insulating film to form the bump. CONSTITUTION: A metal layer is deposited on an insulating film 2 provided on a semiconductor substrate 1 and an etching is selectively performed to form an electrode pad 3. Then, an interlayer insulating film 4 is deposited and an etching is selectively performed to form an aperture 5. Then, an intermediate metal layer 6 is laminated and moreover, an organic insulating film (a polyimide resin film) 7 and photo resist films 8 are provided to perform a patterning. Then, an etching is selectively performed using the films 8 as masks to form an aperture 9 larger slightly than the aperture 5 including the aperture 5 and to expose the layer 6 on the outside of the pad 3. Then, a photo resist film 10 is provided on the whole surface to perform a patterning, an aperture 11 larger than the aperture 9 is provided to cover the layer 6 on the outside of the pad 3, then a bump 12 is formed and a metal layer 13 is provided to remove the resist 10 and to cover the end parts of the film 6 with the film 7. COPYRIGHT: (C)1989,JPO&Japio

Inventors

• 👤 Yoshiyuki Hirano

Bibliographic Details