Radiating structure of electronic component

Abstract

Abstract PURPOSE:To shorten a gap between electronic components, by mounting a heat pipe vertically and in such a manner that a part of a radiating means is located on the side of a board opposite to its mounting side. CONSTITUTION:A heat pipe 28 is connected to a printed board 24 in which an electronic component 12 is mounted on one face thereof. The pipe is mounted vertically to the board. A radiating means 30 and 32 is installed on the top of the pipe to radiate generated heat from the electronic component 12. A part of the radiating means 30 and 32 is installed in such a manner as to be located opposite to the mounting side. According to the constitution, a space where electronic components are mountable can be increased and a gap between neighboring electronic components can be shortened.

Inventors

• 👤 Jiyun Sakiura
• 👤 Katsushi Arai
• 👤 Yasushi Kojima
• 👤 Mitsuaki Suzuki

Bibliographic Details