Semiconductor integrated circuit device and film carrier tape

Abstract

Abstract PURPOSE:To display the high speed performance of a chip in correspondence with the increase in number of input terminals and the implementation of high density, by forming a feed through wiring and a straight line shape without bending in a wire, which is connected to a signal input terminal. CONSTITUTION:In a TAB board, a copper foil is stuck on a flexible long resin film 1, and a signal transmission wire 2, conductor wire 3 and a ground conductor wire 3 and a rear surface ground conductor wire 8 are formed. The ground conductor wire 3 and the rear surface ground conductor wire 8 are connected with a plurality of through hole conductors 5, and a terminating potential is provided. An integrated circuit chip 7 and the signal transmission wire 2 are connected through a protruding electrode 6. The protruding electrode 6 is formed by applying Au plating 62 of a barrier metal layer 61 comprising Ti-Ni-Pd and the like, which is formed on an Al bonding pad 9. The through hole conductors 4 and 5 are formed by Cu plating. Sn plating is applied at the connecting surface with the protruding electrode. The lead-out part of the signal transmission wire 2 is conencted to a terminating potential VTT through a terminating resistor R. The combination of the signal transmission wire 2 and the ground conductors 3 and 8 is adjusted to the specified characteristic impedance. The arranging direction of the signal transmission wire is slightly inclined with respect to the arrangement of an element.

Inventors

• 👤 Kazuyoshi Saito
• 👤 Tomoaki Takubo
• 👤 Toshio Sudo

Bibliographic Details