Semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device without decrease in the packaging density of semiconductor chips and without difficulty in process, by mounting part of a plurality of semiconductor chips on the surface of a second wiring board in parallel. CONSTITUTION:In a semiconductor device, semiconductor chips 1, which are arranged on a second wiring board 3, are positioned in cutout parts 10, which are formed on the sides of first wiring boards 2. The size of the cutout part 10 in the height direction in set so that the size is equal to the sum of the thickness of the semiconductor chip 1, the height of a bump 5a and an interval between the rear surface of the semiconductor chip 1 and the cutout part 10. The size of the height direction is only about 1/20-1/40 the size of the first wiring board 2 in the longitudinal direction. In this part, each semiconductor chip 1 can be mounted simply and efficiently on the side of the second wiring board 3. Therefore the LSI chips having many signal terminals can be assembled adequately as a three-dimensional multiple-chip module without decreasing the packaging density and without difficulty in a process.

Inventors

• 👤 Miyoshi Yoshida
• 👤 吉田　美義

Bibliographic Details