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JPS6399282A Expired / Lapsed JP ⏱️ 0.0 years remaining

Bonding of polyimide formed article

Assignee: Resonac Corp
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Filing: 1986-10-16
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Granted: —
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Expires: 2006-10-16
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Abstract

Abstract PURPOSE:To obtain polyimide formed article laminates, etc., with high adhesiveness, by coating a polyimide varnish, etc., on the specifically treated surface of a polyimide formed article followed by drying and then superposing thereon an adherend to carry out a hot pressing. CONSTITUTION:First, at least part of the surface of a polyimide formed article such as polyimide film is treated with a solution containing a basic compound (pref. KOH or NaOH) followed by treatment with a silane coupling agent (pref. gamma-mercaptopropyl trimethoxysilane or gamma-aminopropyl triethoxysilane) and then performing heat treatment (pref. at 150-250 deg.C for 5-20min). Thence, a polyimide or polyamic acid varnish is coated on said treated surface followed by drying to form a hot-melt type adhesive layer. An adherend is then superposed on this layer followed by hot pressing at temperatures higher than the softening point of said adhesive, thus accomplishing the objective bonding of the polyimide formed product.

Inventors

  • 👤 Shuichi Matsuura
  • 👤 秀一 松浦
  • 👤 Yasuo Miyadera
  • 👤 康夫 宮寺

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 09:31
CPC Classifications
B; B29; B29C; B29C66/00; B29C66/70; B29C66/71

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS4898781A Cited
JPS5454058A Cited
JPS5468654A Cited
JPS5763254A Cited

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