Plasma treating apparatus

Abstract

Abstract PURPOSE:To reduce reaction time between a deposited material and water vapor and to minimize corrosion in a reaction chamber by introducing water gas and the carrier gas and simultaneously evacuating the reaction chamber. CONSTITUTION:Air in a reaction chamber 11 is sufficiently exhausted through a first exhausting valve 27. A carrier gas for steam, e.g., oxygen gas, is introduced into a reaction container 11 through a water storing container 41a. Then, the steam included in a nitrogen gas and a silicon chloride based polymer are reacted, and large amounts of hydrogen chloride and silicon oxide are formed. At this time, a second exhausting valve 51b is opened, and the gas including the hydrogen chloride is exhausted. After the introduction of the nitrogen gas including the steam is conducted for a specified time, the gas exhausting valve 27 is opened, and vacuum state is obtained by the exhaustion. Thereafter, a gas suitable for removing the siliicon oxide is introduced through a reacting gas introducing valve 25. Thus the silicon oxide is removed. The gas is exhausted to obtain the vacuum state again through the exhausting valve 27. Nitrogen gas is introduced through a vent valve 33. The reacting container is opened and cleaned.

Inventors

• 👤 Tsutomu Tsukada
• 👤 勉 塚田

Bibliographic Details