Bonding and adhesive

Abstract

Abstract PURPOSE:To enable fixing of materials to be bonded in a short time without requiring a specific treatment, by using a specific adhesive of normal- temperature anionic polymerization curing type and a specific adhesive of normal-temperature moisture-curing type in such a way that both the adhesives are neither mutually blended nor superimposed. CONSTITUTION:Two kinds of adhesives of (A) an adhesive of normal- temperature anionic polymerization curing type with water consisting essentially of an alpha-cyanoacrylate compound shown by formula I (R is 1-16C alkyl, etc.) and/or a 1,1-disubstituted diene compound shown by formula II (R<1> and R<2> are H, 1-5C alkyl, etc.; R<3> is H or CH3: X and Y are cyano, amido, etc.) and (B) an adhesive of normal-temperature moisture-curing type obtained by adding an anionic polymerization initiator to a main component consisting of a polyisocyanate compound containing two or more isocyanate groups in the molecule and/or a moisture-curing compound of organosilicon compound containing two or more silicons bonded to hydrolyzable groups in the molecule are used in such a way that both the adhesives are neither mutually bonded nor superimposed.

Inventors

• 👤 Naomi Okamura
• 👤 直実 岡村
• 👤 Hiroshi Aoki
• 👤 博 青木
• 👤 Junzo Makino
• 👤 牧野　純三
• 👤 Hajime Yagi
• 👤 八木　肇

Bibliographic Details