Solid-state image sensing device

Abstract

Abstract PURPOSE:To prevent the picture defect of a solid-state image sensor while reducing cost by integrally sealing a mount section, one part of an external lead, the solid-state image sensor, a metallic small-gage wire, a resin and a color filter with a molding resin. CONSTITUTION:A solid-state image sensor 10 is die-bonded with a mount section 91 by an epoxy group resin 40, and wire-bonded with external leads 92 by metallic small-gage wires 5. A color filter 20 is fitted onto the solid-state image sensor 10 through a screen resin 7 shaped onto the surface of a wafer substrate 11, and a filter layer 22 is arranged so as to be precisely positioned onto a light-receiving region 12. The mount section 91, one part of the external leads 92, the solid-state image sensor 10, the metallic small-gage wires 5, the screen resin 7 and the color filter 20 are sealed integrally with a low-cost molding resin 8. Accordingly, a low-cost solid-state image sensing device having no picture defect and high reliability can be acquired.

Inventors

• 👤 Yomiji Yama
• 👤 山　世見之
• 👤 Takashi Kondo
• 👤 隆 近藤
• 👤 Hiroshi Shibata
• 👤 浩 柴田

Bibliographic Details