Semiconductor device

Abstract

Abstract PURPOSE:To reduce thermal stress applied to the contact section of a package cap and a semiconductor chip and a projecting electrode section by integrally constituting a corrugated elastic structure section to the package cap. CONSTITUTION:Sections to which semiconductor chips 2 are not bonded are constituted of corrugated elastic structure 4A in a package cap 4. The corrugated elastic structure 4A absorbs strain even when the strain due to the difference of the longitudinal thermal expansion coefficients of the material of the package cap 4 and the material of the semiconductor chips 2 is generated. Consequently, thermal stress applied to the contact sections of the package cap 4 and the semiconductor chips 2 and projecting electrodes 3 can be reduced. The corrugated elastic structure 4A can easily be organized by being integrally molded with other sections of the package cap 4, and the area of heat dissipation is increased, thus improving the effect of heat dissipation.

Inventors

• 👤 Takashi Ishida
• 👤 尚 石田
• 👤 Toshiya Saito
• 👤 俊哉 斉藤
• 👤 Kunizo Sawara
• 👤 佐原　邦造
• 👤 Yuichiro Taguma
• 👤 田熊　祐一郎
• 👤 Norio Kishikawa
• 👤 岸川　範夫

Bibliographic Details