Semiconductor device and lead frame for it

Abstract

Abstract PURPOSE:To realize a multi-pin structure and to efficiently dissipate the heat to be generated by a semiconductor device by a method wherein the semiconductor device and an inner lead are connected by using a circuit pattern-formed film and is resin-sealed and at the same time a heat spreader which is extended from a stage part is installed between the inner lead and the stage part. CONSTITUTION:An inner lead 14 is formed at a position which is retracted from a stage part 10. Then, a heat spreader 12 is installed in the space between the stage part 10 and the inner lead 14 which is retacted from the stage part 10. A stepped structure is formed near the boundary of the stage part 10 so that the heat spreader 12 comes closer to the external surface of a resin material 32, then bent and sealed. Through this constitution, it is easy to form a multi-pin semiconductor device which can comply with a highly integrated semiconductor chip and at the same time it is possible to efficiently dissipate the heat to be generated by the semiconductor chip.

Inventors

• 👤 Fumio Kuraishi
• 👤 倉石　文夫

Bibliographic Details