Circuit board for mounting of electronic component

Abstract

Abstract PURPOSE:To realize the high density and miniaturization without degrading a moisture characteristic and a heat-dissipating characteristic by a method wherein a circuit board is composed of a metal-coated layer which is formed on the inside of a recessed part to be used for mounting an electronic component at a plastic substrate and a metal substrate which comes into contact with a part of said metal-coated layer inside said substrate. CONSTITUTION:A 2 circuit board made of plastic is composed of three layers, i.e., an upper substrate 2a, an adhesive sheet 26 and a lower substrate 2c. A metal layer 5 is formed directly under a metal-coated layer 3a located on the bottom inside a metal-coated layer 3 which is formed on the inner surface of a recessed part 4 for mounting electronic components. Through this constitu tion, the metal layer 5 comes into direct contact with the metal-coated layer 3 which is formed on the inner surface of the recessed part 4 for mounting an electronic component.s Therefore, the heat which may be generated by an electronic component mounted at the inside of the recessed part 4 for mounting an electronic component can be transferred directly to the metal layer 5 through the metal-coated layer 3a at the bottom. In addition, any moisture which may invade from below can be shut out by the metal layer 5.

Inventors

• 👤 Ikuo Kakimi
• 👤 垣見　育男

Bibliographic Details