Semiconductor device

Abstract

Abstract PURPOSE:To suppress vibration and twisting of an inner lead, by providing a plurality of recessed long grooves in the slant direction with respect to the longitudinal direction of the inner lead so that the slant directions are alternately reversed. CONSTITUTION:Attachment and assembling of a lead is performed by using a lead frame in a resin sealed type semiconductor device. Recessed grooves 2, 2... are formed in the slant directions with respect to the longitudinal direction of the lead in the surface of the inner lead of the lead frame in a resin sealed region of the device so that the slanting directions are alternately reversed. Since the recessed grooves are formed in the slant directions, position accuracy is not required and machining is easy. The machining is performed at the same time as the bending of suspending pins for suspending an island from the lead plane,and the machining can be performed without increasing man-hours. Therefore vibration of the inner lead in the up and down directions and twisting are eliminated and the yield of breakdown of bonding wire is prevented.

Inventors

• 👤 Yoshihiro Ishizuka
• 👤 石塚　良博

Bibliographic Details