Lead frame for electronic component

Abstract

Abstract PURPOSE:To reduce the level of thermal stress due to mismatching of thermal expansion coefficient down to a negligible level by dividing tab part loading component elements into multiple parts. CONSTITUTION:Tab part loading part elements is divided into multiple parts to form divided parts 11, 12. The fluctuation in strain epsilon due to thermal stress is represented by epsilon = (thermal expansion coefficient) T.l(where l; one side length of tab, T; temperature fluctuation, (thermal expansion coefficient); difference in thermal expansion coefficient between tab and element. When tab is divided to shorten the length l, epsilon is decreased. Through these procedures, the level of thermal stress due to mismatching of thermal expansion coefficient can be reduced down to negiligible level.

Inventors

• 👤 Shoji Shiga
• 👤 志賀　章二
• 👤 Toru Tanigawa
• 👤 徹 谷川
• 👤 Masaaki Kurihara
• 👤 正明 栗原

Bibliographic Details