Apparatus for measuring adhesion strength of film

Abstract

Abstract PURPOSE:To detect the adhesion strength of a film with high accuracy, by a method wherein a temp. regulator and a film plate (specimen) fixing jig are provided to a specimen mount stand and a cutting blade is pressed to the film on a film plate to cut the same and the cutting pressure of said blade is detected to be subjected to wave form analysis by a personal computer. CONSTITUTION:A film plate (specimen) 5 is fixed to the fixing jig 6 of a specimen stand 4. Further, connection members 10, 11, 15 are assembled and a slide member 14 is provided to the member 15 while a guide shaft 16 is provided to the member 14 and a cutting blade 17 is mounted to said shaft 16 in an up-and-down movable manner. A wt. 19 is further placed on the upper part of the guide shaft 16. Then, the cutting blade 17 is pressed to the film plate (specimen) 15 and the specimen mount stand 4 is allowed to slide to cut the film on the film plate 15. The interface resistance force of the cutting blade 17 is detected by a detector 21 and wave form measuring data is processed according to a Fourier transform program by a personal computer 24 to output information. Further, a temp. regulator 25 is provided in the specimen amount stand 4 to control the temp. of the film plate (specimen) 5. Since the interface cutting resistance force of the cutting blade 17 is processed by the personal computer for wave form analysis, the adhesion strength of the film can be measured with good accuracy.

Inventors

• 👤 Itsuo Nishiyama
• 👤 逸雄 西山
• 👤 Tetsuo Mitani
• 👤 徹男 三谷

Bibliographic Details