Semiconducotr integrated circuit device

Abstract

Abstract PURPOSE:To simplify the assembling process of image sensors while preventing them from various problems due to contamination, by previously forming terminals for connecting the interior and the exterior of the device, a filter and a lighttransmitting cap in an integral manner, and connecting the semiconductor chip to the terminals by means of bumps. CONSTITUTION:Terminals 11 are provided integrally at the opposite ends of a light-transmitting cap 12 while a filter 13 is provided integrally in the central light-transmitting section of the cap 12. Bumps 16 are provided on a chip 15 for connecting the chip to the external terminals without using bonding wires. An adhesive 14 serves not only as an adhesive for fixing the chip 15 to the cap 12 through the filter 13 but also as a gap filler. Finally, the cap 12 is fixed to a case 17 by means of an adhesive to finish the production of a semiconductor integrated circuit device. Since only one process to put something on the chip is included in such method, the chip can be effectively protected against contamination which would cause defects in an assembled image sensor.

Inventors

• 👤 Mamoru Kajiwara
• 👤 梶原　護

Bibliographic Details