Method for packaging circuit substrate

Abstract

Abstract PURPOSE:To render a circuit module to be extremely thin by a method wherein an element installation position is a hole in a circuit board and a lining sheet or film capable of separation is bonded to one side of the circuit board. CONSTITUTION:At a position for the installation of a semiconductor element 3 on a circuit board 1, a hole is provided, which is large enough to accommodate the semiconductor element 3. For the fixation of the semiconductor element 3, a lining sheet or film 2 is bonded to a surface of the circuit board 1 opposite to the side whereon a circuit pattern 5 exists. The semiconductor element 3 is provisionally fixed to the film 2, connection is established by wire bonding or the like between the semiconductor element 3 and the pattern 5, sealing is accomplished by a sealing resin 6, and then the film 2 is peeled off the circuit board 1. In this way, a circuit board wherein a semiconductor element is fixed may be lessened in thickness and the element height after packaging may be reduced to the minimum, which results in an extremely thin circuit module.

Inventors

• 👤 Yoshihiko Kasahara
• 👤 笠原　良彦

Bibliographic Details