Stem

Abstract

Abstract PURPOSE:To bond a semiconductor pellet and a bonding post section efficiently by ultrasonic waves while attaining lightening and the improvement of reliability of the device by fast sticking the lower surface of the bonding post section to a plane formed by an insulating member and the surface of a stem body. CONSTITUTION:A lead inserting hole 14 for inserting a lead 13 is shaped to a stem body 12 with a disposal floor for a semiconductor pellet 11. The lead 13 is introduced and fixed into the lead inserting hole 14 so that the lower surface of a bonding post section 15 in the lead 13 is fast stuck to a plane consisting of an insulating member 16 composed of glass, etc. interposed into the lead inserting hole 14 and the surface of the stem body 12 and an outer lead section in the lead 13 is lead out to the other side of the stem body 12. Accordingly, when ultrasonic bonding is executed between the semiconductor pellet 11 and the bonding post section 15, the damping of vibrating force by ultrasonic waves can be prevented, thus efficiently conducting bonding having high quality and high reliability.

Inventors

• 👤 Masahisa Ogushi
• 👤 大串　昌久

Bibliographic Details