Semiconductor device

Abstract

Abstract PURPOSE:To miniaturize the semiconductor device by simplifying the lead forming process simultaneously increasing the numbers of resin formed devices per unit space by a method wherein a semiconductor chip and leads fixed on a die pad are electrically connected while the die pad and the semiconductor chip leaving a part of leads are sealed with resin member. CONSTITUTION:A semiconductor chip 2 and leads 3 fixed on a die pad 1 are electrically connected while the die pad 1 and the semiconductor chip 2 leaving a part of leads 3 are sealed with resin member 5. The exposed parts 31 of leads 3 almost flush with the surface of resin member 5 are used as the terminals for external connection. In order to manufacture such a device, e.g. firstly a leadframe on the same plane is formed into stepwise leads 3 using a metal die. Next, the chip 2 is fixed on the die pad 1 using bonding agent simultaneously connected to the opposite surface to the exposed parts 31 of leads 3 by metal wires 4. In such a constitution, after forming the die pad 1 to expose the parts 31 of leads 3 as they are using the resin member 5, the other ends of leads 3 are cut off near the side of resin member 5.

Inventors

• 👤 Akiyoshi Azuma
• 👤 東　晃義

Bibliographic Details