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JPS63254760A Expired / Lapsed JP ⏱️ 0.0 years remaining

Package for surface mounted component part

Assignee: Ibiden Co Ltd
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Filing: 1987-04-10
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Granted: —
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Expires: 2007-04-10
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Abstract

Abstract PURPOSE:To make a large electronic circuit easy to handle as one block, by providing conductor pins, which are electrically connected to another board and the like and connecting parts for mounting surface mounted parts on the rear side, and providing conductor pins for confirming the programs and/or operations of the individual surface mounted parts on the upper surface side. CONSTITUTION:Second conductor pins 9, which are electrically connected to another board 3 and the like and connecting parts 7 for mounting surface mounted parts 5 are arranged on the rear surface of a package 1 for the surface mounted parts. First conductor pins 2 for confirming programs and/or operations of the individual surface mounted parts 5 are provided on the upper surface. Thus, the first conductor pins 2, which are required for the connections between the package 1 for the surface mounted parts and the outside, are connected to the second conductor pins 9 through conductor circuits 6 in a printed wiring board 4 as an adapter. The first conductor pins 2, which must be connected for the package 1 for the surface mounted parts, can be connected through the conductor circuit 6 of the printed wiring board as the adapter.

Inventors

  • 👤 Kazumasa Adachi
  • 👤 足立 和正
  • 👤 Shinji Takahashi
  • 👤 伸治 高橋
  • 👤 Kimitaka Hirabayashi
  • 👤 平林 公隆

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 06:47
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/144; H05K1/18; H05K1/181

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