Equipment for manufacture of semiconductor device

Abstract

Abstract PURPOSE:To perform a process for retaining the thickness of a film to be etched at a desired value by providing a film thickness measuring unit or ellipsometer for measuring the remaining thickness of an insulating film or a semiconductor film during etching to arbitrarily monitor the advancement of the etching. CONSTITUTION:A laser light emitted from a light emitting unit 7 of an ellipsometer E is reflected on a semiconductor substrate 5 placed on a stage 6 in a chamber 2 through a window 4, radiated from the opposite side of the window 4, and introduced into an ellipsometer photodetector 3. The thickness of the etched film on the substrate 5 is sampled by the ellipsometer E during sampling. The target values of the sampled film thickness and the remaining film thickness are compared by a comparator 14, and when they arrive at the object value, the etching is finished. Thus, the thickness of the remaining film of the etching can be accurately controlled.

Inventors

• 👤 Tomio Yamamoto
• 👤 山本　冨男

Bibliographic Details