Patent JPS63252455A successfully refreshed from Google Patents.
JPS63252455A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: NEC Corp
•
Filing: 1987-04-09
•
Granted: —
•
Expires: 2007-04-09
Abstract
Abstract PURPOSE:To prevent the cracking of a package by forming a bending section to at least one part of the periphery of an island section for a lead frame. CONSTITUTION:Bending sections 6, both of which are bent inward, are shaped on both sides of an island 5 for a lead frame, and a semiconductor pellet 4 is mounted onto the island 5. Resin seal is conducted by a molding resin 1, combining the protection of wires 3 and the protection of the pellet 4. Consequently, thermal stress does not concentrate to one position. Accordingly, the cracking of a package is prevented.
Inventors
- 👤 Shigemi Hatanaka
- 👤 畠中 茂実
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 19:43
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.