Rotating magnetic field type magnetron etching device

Abstract

Abstract PURPOSE:To carry out highly uniform dry etching with a low discharge voltage by arranging plural electromagnetic coils around the electrodes opposed to each other in a vacuum vessel, and generating a rotating magnetic field in parallel with the surfaces of the electrodes. CONSTITUTION:Two electrodes 1 and 2 are arranged in the vacuum vessel and opposed to each other, plasma is produced between both electrodes 1 and 2 by a high-frequency power source 4 and a substrate 3 is dry-etched. A pair of electromagnetic coils 5a and 5b and a pair of electromagnetic coils 6a and 6b are arranged around the electrodes 1 and 2 at right angles to each other. An electric current and the current with the phase lagging by 90 deg. are respectively applied to the two pairs of electromagnetic coils 5a and 5b and 6a and 6b from AC power sources 5c and 6c. Consequently, a rotating magnetic field parallel to the surfaces of the electrodes 1 and 2 is generated. By the rotating magnetic field type magnetron etching device of such a structure, a stabilized magnetic field is formed on the electrodes 1 and 2, the discharge voltage is stably kept low, the plasma is uniformized, and etching can be uniformly carried out without ion damage.

Inventors

• 👤 Masashi Kikuchi
• 👤 正志 菊池

Bibliographic Details